[New Product] Advantech EPC-R7300 Industrial Barebones PC for NVIDIA Jetson Orin NX and Orin Nano Modules Covers Everything from Development to Production

Taipei, Taiwan, March 2023 — Advantech, a leading industrial embedded AI solution provider, is proud to announce the release of its EPC-R7300, an industrial barebones PC for the NVIDIA® Jetson Orin™ NX and Jetson Orin Nano systems-on-modules. Leveraging powerful NVIDIA Jetson Orin modules, the EPC-R730For easy AI deployment, the EPC-R7300 features an ultra-compact form factor (152×173×50 mm) with diverse rear I/O configuration options, delivering excellent flexibility and computing performance for next-generation robotics, surveillance, and other applications using edge inference.

A Highly Reliable Single AI Kit for NVIDIA Jetson Orin NX and Orin Nano
Advantech’s EPC-R7300 industrial-grade barebones PC is equipped with a production carrier board and mainstream I/O functions including RS-485, CAN bus, and multiple Ethernet ports — fully compatible with NVIDIA Jetson Orin NX and Orin Nano modules — satisfying various computing needs of developers. The EPC-R7300 will be supported by NVIDIA JetPack 5.1, making it easy to migrate from the NVIDIA development kit to the barebones PC or between different Jetson Orin modules. It will also help AI developers automatically actuate I/Os without further driver installation or configuration. Edge AI applications — including image inferencing — require premium-quality camera inputs. Accordingly, the EPC-R7300 provides USB, IP, and MIPI-CSI camera interfaces for intelligent vision-based systems. It also features 1 x HDMI 2.0 port for 4K resolution displays, 2 x GbE LAN for data connectivity, 2 x USB 3.2 Gen 1 ports, and 3 x M.2 slots for wireless modules and storage expansion (1 x 2230 E-Key for Wi-Fi 6 and Bluetooth, 1 x 3042/52 B-Key for 4G/5G, and 1 x 2280 M-Key for NVMe SSD).

In terms of ruggedness, Advantech’s EPC-R7300 can tolerate a wide range of operating temperatures and power inputs and has a high vibration tolerance (-40 ~ 85 ºC / -40 ~ 185 ºF; 9 ~ 36 VDC; 3.0 Grms). This, in turn, helps users produce field-side prototypes while significantly reducing the development time and resources required for system integration, verification, and transformation into a ready-to-use edge AI system.

Diverse Rear I/O Configurations Accommodate a Myriad of Application Requirements
Designed to fulfill different application requirements in one kit, the EPC-R7300 provides up to 5 rear I/O configurations, including serial ports (RS-232, RS-485), isolated DIOs, USB 2.0, and a 4-port GbE hub to enable system capacity expansion. The I/O peripheral drivers are all integrated into the board support package (BSP) with NVIDIA JetPack 5.1, making the EPC-R7300 capable of delivering excellent functionality without additional integration work.

1 x RS-485, 1 x RS-232, 1 x 4 DIs & 4 DOs
1 x GbE, 2 x USB2.0, 2 x RS-232
1 x CAN bus, 2 x RS-232
4 x GbE
4 x GbE (3 x LAN, 1 x WAN)

ROS2 Suite — Ready for Robotics Development and Integration
These Jetson-based platforms will be supported by the ROS2 Suite, a coordinated and proven software package built on Advantech’s AIM-Linux embedded software and designed to support Robot Operating System (ROS) environments. The ROS2 Suite includes the SUSI API. SUSI is a suite of application interfaces that enables users to monitor and control digital I/O, I2C, and watchdog timers directly. Industry protocols and edge time-series database software are also implemented for ROS industrial applications. Furthermore, general ROS utilities such as RVIZ and MoveIt are pre-integrated to shorten application development time. The Isaac ROS SDKs will be consolidated into the ROS2 Suite to increase edge intelligence efficiency using GPUs inside the processor. With high software integration, the EPC-R7300 significantly reduces the time and resources required for robotics development.

Advantech’s EPC-R7300 samples will be ready in Q1 of 2023. For more information, please contact the Advantech sales team, an authorized distributor, or visit the EPC-R7300 product page.

EPC-R7300 Key Features
● Industrial fanless barebones PC with dimensions of 152×173×50 mm
● Compatible with NVIDIA Jetson Orin NX and Jetson Orin Nano
● NVIDIA JetPack 5.1 support
● Five rear I/O configurations available for different requirements
● Rugged barebones PC chassis supports a wide operating temperature range, wide power input range, and vibration tolerance (-40 ~ 85 ºC (-40 ~ 185 ºF / 9 ~ 36 VDC / 3.0 Grms)
● The ROS2 Suite supports robotics development